TIF100-01F Thermally Conductive Gap Filler Pads black thermal pad for Laptop
Product descriptions
TlFTM100-01F Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.
Features
> Good thermal conductivity 1.5W/mK
> NMoldability for complex parts
> Soft and compressible for low stress applications
> Moldability for complex parts
> Outstanding thermal performance
> High tack surface reduces contact resistance
Application
> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
| Typical Properties of TIFTM100-01F Series |
| Color | Black | Visual |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** |
| Thickness range | 0.010"~0.200"(0.25mm~5.0mm) | ASTM D374 |
| Hardness | 60 (Shore 00) | ASTM 2240 |
| Specific Gravity | 2.3 g/cc | ASTM D297 |
| Continuos Use Temp(℃) | -40~200℃ | ****** |
| Dielectric Breakdown Voltage | >5500 VAC | ASTM D149 |
| Dielectric Constant | 4.0 MHz | ASTM D150 |
| Volume Resistivity | 2.0X10¹² Ohm-meter | ASTM D257 |
| Thermal conductivity | 1.5 W/m-K | ASTM D5470 |
| Flame Rating | 94-V0 | UL E331100 |
Standard Thicknesses
0.020-inch to 0.200-inch (0.5mm to 5.0mm)
Product Sizes:
8" x 16"(203mm x406mm),Individual die cut shapes and custom thickness can be supplied.
Please contact us for confirming
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
Vietnam Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Ziitek Culture
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.
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TIF100-01F Thermally Conductive Gap Filler Pads black thermal pad for Laptop Images
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